Semi-automatic stencil printer with camera system SMT/SMD

Semi-automatic stencil printer with camera system Technical data: Frame size: max. 550 x 470 mm quick-clamping frame - 4-sided stencil possibility of using frames with any dimensions with consideration of the maximum size Printed circuit board size: max. 400 x 375mm Printed surface size: max. 350 x 340 mm Camera system: semi-automatic PCB positioning 2 color CCD cameras / 17" LCD monitor Squeegee drive: electric drive / speed adjustable in the range of 5 - 150mm/s (tol. +/- 5%) programming of any automatic squeegee movement through an external control panel programming of other parameters via USB interface Squeegee system: automatically switching dual squeegee head universal holders for steel or plastic inserts squeegee pressure adjustable in the range of 0 – 200N adjustable squeegee tilt angle in the range of 0 - 60° Printing: single or double-sided Table lowering: automatic / separation range Z=10 mm separation speed adjustment 0.2 - 4 mm/s Special printer functions: electronic process control system Table position adjustment range - X, Y / Theta +/- 5 mm / +/- 2.0° Table positioning resolution: +/- 0.01 mm Power supply: 220 VAC / 200 W / compressed air 6 bar Dimensions / weight: 860 x 650 x 400 mm / approx. 86 kg Application: low- or medium-volume production device adapted for screen printing or stencil printing printing glue, solder paste, or other media on any substrate minimum pitch 0.3mm. SMT/SMD printer is a device used in the electronics manufacturing process, which is used to apply solder paste to printed circuit boards before placing SMT/SMD components (surface mount technology). SMT/SMD printers work on the principle of screen printing, but instead of ink, they apply solder paste to the printed circuit board. For this purpose, the printer has a stencil or a template, which places the solder paste in the appropriate places on the printed circuit board. SMT/SMD printers are crucial in electronics manufacturing because they allow for precise application of solder paste to SMT/SMD components, which has a decisive impact on the quality and reliability of the end product.